PCB Capabilities - Empowering innovators to turn ideas into reality

Standard PCB Capabilities

Items		Manufacturing Capabilities	Remarks
Number of Layers	-	1-14 layers	For orders above 14 layers, please view the below "Advanced PCB" or contact our sales rep.
Material	-	FR-4, Aluminum, Copper Base	For Flex, Rigid-flex, HDI, Halogen-free, High Tg, etc., please view the below "Advanced PCB" or contact sales rep.
Maximum PCB Size(Dimension)	-	Single-sided PCB and double-sided PCB: 6001200mm Multilayer PCB: 5601150mm (min 3*3mm)	Any sizes beyond this dimension, please view the below "Advanced PCB" or contact sales rep.
Board Size Tolerance(Outline)	-	±0.2mm/±0.5mm	±0.2mm for CNC routing, and ±0.5mm for V-scoring.
Board Thickness	-	0.2-3.2mm	0.2,0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4, 2.6, 2.8, 3.0, 3.2mm. Please view the below "Advanced PCB" or contact us if your board exceeds these.
Board Thickness Tolerance(t≥1.0mm) Board Thickness Tolerance(t≥1.0mm)	-	±10%	Normally "+ Tolerance" will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
Board Thickness Tolerance(t<1.0mm)	-	±0.1mm
Min Trace	-	0.1mm/4mil	Min manufacturable trace is 4mil(0.1mm), Please view the below "Advanced PCB" or contact us if your board exceeds these.
Min Spacing	-	0.1mm/4mil	Min manufacturable spacing is 4mil(0.1mm), Please view the below "Advanced PCB" or contact us if your board exceeds these.
Outer Layer Copper Thickness	-	1oz/2oz/3oz/4oz/5oz/6oz/7oz/8oz (35um/70um/105um/140um/175um/210um/245um/280um)	Also known as copper weight. 35μm=1oz, 70μm=2oz, 105μm=3oz, 140um=4oz, 175um=5oz, 210um=6oz, 245um=7oz, 280um=8oz, Please view the below "Advanced PCB" or contact us if you need copper weight greater than 8oz.
Inner Layer Copper Thickness	-	1oz/1.5oz/2oz/3oz/4oz (35μm/50μm/70um/105um/140um)	Inner copper weight as per customer's request for 4 to 10 layers(Multi-layer laminated structure). Please contact us if you need copper weight greater than 4oz.
Drill Sizes (CNC)	-	0.15-6.0mm	Min drill size is 0.15mm, max drill is 6.0mm. Any holes greater than 6mm or smaller than 0.2mm will be subject to extra charges.
Min Width of Annular Ring	-	0.15mm(6mil)	For pads with vias in the middle, Min width for Annular Ring is 0.15mm(6mil).
Finished Hole Diameter (CNC)	-	0.15-6.0mm	The finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels
Finished Hole Size Tolerance(CNC)	-	PTH: +/-0.08mm, NPTH: +/-0.05mm	For example, if plated through hole size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable.
Solder Mask	-	LPI	Liquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards.
Minimum Character Width(Legend)	-	0.15mm	Characters of less than 0.15mm wide will be too narrow to be identifiable.
Minimum Character Height (Legend)	-	0.8mm	Characters of less than 0.8mm high will be too small to be recognizable.
Character Width to Height Ratio (Legend)	-	1:5	In PCB silkscreen legends processing, 1:5 is the most suitable ratio
Minimum Diameter of Plated Half Holes	-	0.4mm	Design Half-Holes greater than 0.4mm to ensure better connection between boards.
Surface Finishing	-	HASL with lead, HASL lead free, Immersion gold, OSP, Hard Gold, Immersion Silver, Immersion Tin, ENEPIG;	Please view the below "Advanced PCB" or contact us for other finishes.
Solder Mask	-	Green ,Red, Yellow, Blue, White, Black, Matt green, Matte black, Purple, none;	No extra charge (Green, Red, Yellow, Blue)
Silkscreen	-	White, Black, Yellow, None	No extra charge (White, Black)
Panelization	-	V-scoring, Tab-routing, Tab-routing with Perforation (Stamp Holes)	Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero.
Others	-	Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008,UL Certificate	No extra charge.

Advanced PCB Capabilities

Categories	No.	Items			PCB process parameters				Remarks
					Normal process	Medium difficulty	High difficulty
					Normal process	Medium difficulty	Non-standard review	Unable to make
product type	1	Multilayer PCB Layers			3L≤Layers≤16L	18L≤Layers≤24L	≥24L
	2	Blind and Buried Vias			HDI(1+1+....+N+......+1+1)	Anylayer HDI	HDI(2+...+N...+2)		If meet the requirements of 2, 6, and 21 at the same time, it is classified as a high requirement product (thickness to diameter ratio, copper thickness of hole)
	3	Surface Coating			HASL(+gold finger),immersion gold, Immersion Gold +gold fingers with hard gold,OSP (+gold finger with hard gold), Immersion Tin (+gold finger with hard gold) (Not two different surface finish),Immersion Tin	Local immersion gold (long or short gold fingers, segmented gold finger craft)	Exceed this range require unconventional production processes		Partial immersion gold, thickness of gold or nickel reference to the thickness of the coating
	4	Board Material			FR-4;aluminum,Rogers4 series + FR-4 mixed(The Prepreg is ShengYi brand and ROGERS4403 series);CEM-3、LianMao IT158/IT180A	Pure ROGERS4 series multi-layer board (Prepreg is 4450F),PTFE、aluminum+FR4、PTFE+FR4	Exceed this range require unconventional production processes	Pure PTFE multi-layer board	Pure PTFE can’t be made because the lamination temperature isn’t up to standard,Can‘t laminate Rogers copper foil directly
Drills	5	Drill diameter	Nc drill		0.20mm≤Drill diameter≤6.5mm More than 6.0mm using CNC milling hole diameter 0.2mm: maximum board thickness 1.6mm hole diameter diameter 0.25mm:maximum board thickness 2.0mm, hole diameter 0.3mm≤Ф≤0.35mm, maximum board thickness 3.2 mm, hole diameter 0.4mm≤Ф≤0.55mm, maximum board thickness 4.8 mm, hole diameter>0.55mm maximum board thickness 6.4 mm	6.5mm or more ±0.1mm ≤ hole diameter tolerance (using CNC milling for 6.5mm or more)	The drill diameter more than 6.0mm, the hole diameter tolerance less than ±0.1mm. If exceed this range require unconventional production processes		Drill diameter below 0.2mm, and the aspect ratio≥10, which is medium difficulty
	6	Thickness to diameter ratio			Thickness to diameter ratio≤8	8	10	Thickness to diameter ratio greater than 12 when the aperture cannot be compensated	If need to meet the requirement of 2, 6, and 21, it will be treat as high requirement product.
	7	countersink	hole diameter		3.0mm≤hole diameter≤6.5mm		Unconventional production beyond this range		Countersink depth tolerance is controlled 0.15mm
	7	countersink	Angle		90°		Unconventional production beyond this range		Countersink depth tolerance is controlled 0.15mm
	8	Hole position tolerances			±0.075mm		±0.05mm	<+/-0.05mm
	9	hole diameter tolerance	PTH		±0.075mm or no customer requirements	±0.05≤ hole diameter tolerance <±0.75mm	<±0.05mm	<+/-0.05mm	Metallized hole diameter tolerance of 6.0mm or more refers to the requirement of serial number 5
			NPTH		≥±0.075mm		<±0.05mm	<+/-0.025mm
			Special hole	pressfit	≤±0.05	\	\
				non-plated Countersink/Counterbore holes(NPTH)	hole diameter <10mm:tolerance ±0.15mm,hole diameter ≥10mm:tolerance ± 0.20mm	\	\
				non-plated Countersink/Counterbore holes（NPTH）	hole diameter <10mm:tolerance ±0.2mm hole diameter ≥10mm:tolerance+0.3mm	\	\
	10	Hole to hole spacing	component hole		≥16MIL	14≤Hole to hole spacing≤16	13≤Hole to hole spacing≤14	<13mil
	10	Hole to hole spacing	via（≤0.45mm）		≥11MIL
	11	Slot (Cut-out)	Slot width		Plated slot ≥0.5mm Non-plated slot ≥0.8mm	\	\		More than 1.0mm, can be slot by machine
	11	Slot (Cut-out)	Length to width ratio of slot		Length to width≥2	Length to width<2
	12	Castellated Holes	Castellated Holes diameter		≥0.5mm	0.5mm>diameter≥0.4mm	\
	12	Castellated Holes	Castellated Holes spacing (edge to edge)		≥0.3mm	0.3mm>diameters≥0.2mm	\
	13	Minimum isolation ring of Inner layer, The distance between minimum hole in Inner layer and circuit (before compensation)	4L		≥7MIL	6MIL≤isolation ring, distance<7MIL	5MIL≤isolation ring, distance<6MIL		If the size of one side is greater than 600MM, the inner hole to line and the hole to copper spacing must be greater than or equal to 15mil. If less than 15mil, it must be treated as unconventional review. The conventional process of 10 layers or more need to be incremented by 1 mil for each additional 2 layers. Change the isolation ring to 12mil or more as much as possible
			6L		≥8MIL	6.5MIL≤isolation ring, distance<8MIL	6MIL≤isolation ring, distance<6.5MIL
			8L		≥9MIL	7MIL≤isolation ring, distance<9MIL	6MIL≤isolation ring, distance<7MIL
			≥10L		≥10MIL	8MIL≤isolation ring, distance<10MIL<9MIL	7MIL≤isolation ring, distance<8MIL
image transfer	14	The min width/spacing of inner layer (before compensation)	copper thickness 18um		≥4/4 mil	≥4/3.5 mil		<3.5/3 mil	width/spacing
			copper thickness 35um		≥4/5 mil	≥4/4 mil		<3.5/4 mil	width/spacing
			copper thickness 70um		≥6/8mil	≥6/7mil		<5/6 mil	width/spacing
			copper thickness 105um		≥8/11 mil	≥8/10 mil		<6/9 mil	width/spacing
	15	The min width/spacing of outer layer (before compensation)	copper thickness 18um		≥4/5 mil	≥4/4 mil or parts 3.5/3.5mil		<3.5/3.5 mil	Local 3.5/3.5mil, only the distance from the GBA chip area line to the PAD
			copper thickness 35um		≥5/6 mil	≥5/5 mil		<4/4 mil
			copper thickness 70um		≥7/8mil	≥6/7mil		<5/6 mil
			copper thickness 105um		≥10/12 mil	≥8/10 mil		<6/9 mil
	16	grid trace width/spacing	copper thickness 18um		≥7/9 mil	≥6/8 mil		<6/7 mil
			copper thickness 35um		≥9/11 mil	≥8/10 mil		<8/9 mil
			copper thickness 70um		≥11/13mil	≥10/12mil		<10/11 mil
			copper thickness 105um		≥13/15 mil	≥12/14 mil		<12/13 mil
	17	Minimum weld ring (outer layer)	copper thickness 18um	via hole	≥5mil	≥4mil	<3 mil
			copper thickness 18um	component hole	≥8mil	≥6mil	<6 mil
			copper thickness 35um	via hole	≥5mil	≥4mil	<3 mil
			copper thickness 35um	component hole	≥10mil	≥8mil	<8 mil
			copper thickness 70um	via hole	≥7mil	≥6mil	<5 mil
			copper thickness 70um	component hole	≥12mil	≥10mil	<10 mil
			copper thickness 105um	via hole	≥8mil	≥6mil	<6 mil
			copper thickness 105um	component hole	≥14mil	≥12mil	<12 mil
	18	width tolerance			width tolerance:≥±20%	±10%≤ width tolerance:<±20%	<±10%		spacing must meet the requirements of 11 and 12, lf width is greater than 15mil, controlled by ±2.5mil
		BGA pad diameter	hot air leveling (original)		≥12MIL	≥10MIL		<8mil
		BGA pad diameter	immersion gold (original)		diameter≥11mil	8.0mil≤diameter<11.0mil		<6mil
	19	Line to board edge distance	CNC milling		0.25mm	0.20mm	<0.20mm
	19	SMT width			≥12mil	≥9mil	<9mil以下		<7mil,except the binding board
Metal plating	20	Plating Thickness(µin)	Electroless Nickel-Immersion Gold,ENIG	Nickel thickness	100-150 µin	200 µin
			Electroless Nickel-Immersion Gold,ENIG	gold thickness	1-8 µin			>8 µin
			Full board gold plating	Nickel thickness	100-150 µin		200-500 µin		Order center check the final price
			Full board gold plating	gold thickness	1-10 µin	10-50 µin		>50 µin
			gold finger	Nickel thickness	120-150 µin		200-400 µin
			gold finger	gold thickness	1-30 µin	30-50 µin		>50 µin
	21	Hole copper thickness (µm)	Through hole		18-25 µm	30-50 µm	>50 µm		If 2,6,19 is required to exist at the same time, it will be treated as high requirement. The thickness of the copper is 25-50UM, and the thickness of the copper is required to be 2-3OZ generally.
			Blind hole (mechanical hole)		18-25 µm	30-50 µm	>50 µm
			Buried hole		15-25 µm	30-50 µm	>50 µm
	22	Bottom copper thickness	Inner and outer copper thickness (OZ)		0.5-4	4-6		>6
solder mask	23	solder mask	green solder mask opening（mil）		≥2mil	1.5	1		1mil is only concentrated in the BGA area. If the window can be enlarged, increase it as much as possible, but the maximum is 3mil
			green solder mask Bridge（mil）	copper thicknesss<2OZ	4（spacing between ICs is 8 mil, green oil），variegated or black oil≥4.5mil	3-4（spacing between ICs is 7-8 mil, green oil），variegated or black oil≥4mil
			green solder mask Bridge（mil）	copper thicknesss≥2OZ	5	4
			Plug Hole diameter		0.20mm≤hole diameter≤0.40mm，plug hole fullness 70%	0.4mm< hole diameter ≤0.70mm	fullness 100%
			Plug Hole board thickness		0.40mm≤board thickness≤2.4mm	>2.4MM
	24	solder mask	solder mask color		Green, matt green, blue, red, black, matte black, white, yellow	\	\		Special colors need to be purchased or deployed in advance
silkscreen	25	Etched silkscreen (finished copper thickness)	Copper thickness 18um	word width/word height	8MIL/40MIL	7MIL/35MIL
			Copper thickness 35um	word width/word height	9MIL/40MIL	8MIL/35MIL
			Copper thickness 75um	word width/word height	12MIL/60MIL	10MIL/50MIL
			Copper thickness 105um	word width/word height	16MIL/60MIL	14MIL/50MIL
outline	26	Maximum board thickness	Double PCB		3.2MM	4.5MM	>4.5MM		calculated by 4 layers if the thickness more than 3mm
	26	Maximum board thickness	Multilayer layer board		3.2MM	4.5MM	>4.5MM
	27	Minimum board thickness (single and double panel refers to substrate thickness)	Single or Double side PCB (pcb prototype)		≥0.3mm	0.25mm
			4L		≥0.60mm	0.40mm	<0.40mm
			6L		≥0.9mm	0.70mm	<0.70mm
			8L		≥1.20mm	1.00mm	<1.00mm
			10L		≥1.40mm	1.20mm	<1.20mm
			12L		≥1.70mm	1.50mm	<1.50mm
			14L		≥2.00mm	1.80mm	<1.80mm
	28	thickness (T) tolerance MM (multilayer layer pcb)	T≤1.0		±0.10		Need to review if less than the tolerance		If the tolerance is unilateral tolerance, the tolerance shall be double tolerance value, such as: 1.8mm requires positive tolerance, the tolerance shall be 0-0.36mm
			1.0		±0.13
			1.6		±0.18
			2.5		±0.23
			T≥3.2		±8%
	29	Maximum finished board size	Single and double side PCB		508×610mm	Beyond this range needs to be reviewed
	29	Maximum finished board size	Multilayer Layer PCB		508×600mm	Beyond this range needs to be reviewed
	30	Minimum finished pcb size			≥20mm	10mm≤Size<20mm	<10mm
	31	Beveling for gold finger	Bevel angle		20°30°45°60°		<20°Or>60°
			Bevel angle tolerance		>±5°	±5°	<±5°
			Bevel depth tolerance		tolerance≥±0.15mm	±0.15mm< Tolerance ≤ ±0.1mm	tolerance<±0.10mm
	32	Shape tolerance			tolerance≥±0.15mm	±0.10mm≤tolerance<±0.15mm		Tolerance<±0.10mm or more than two form tolerance control
	33	V-CUT	Angle		20°30°45°60°
			The Maximum number of V-CUT		In 20 times	In 30 times	In 40 times
			Width of the shape		80MM< width <560MM	60MM< width <80MM	width <60MM
			board thickness		0.6MM≦thickness≦2.4MM	0.5MM≦thickness<0.6MM	thickness<0.5MM or thickness>2.4MM		below 0.5mm is single-sided V-CUT
			Remaining thickness		≥0.25MM			<0.25MM
			V-CUT		Conventional V-CUTT、V-CUT: Skip V-CUT	\	\
others	34	panel size	The minimum panel size		≥100*120mm	\	<100*120mm		The thickness of the finished board is less than 0.4MM, the panel size can’t exceed 14inch, and the maximum size of the HASL PCB can’t exceed 24inch
	34	panel size	the Maximum panel size		≤20*24 inch	\	Need to review if beyond range
	35	impedance control	Impedance control tolerance		±10%，50Ω and below：±5Ω	\	<±10%，50Ω and below <±5Ω
	35	bow and twist	bow and twist tolerance		bow and twist≤0.75%	0.5%≤bow and twist≤ 0.75%	bow and twist<0.5%		asymmetry boards bow and twist tolerance 1.2%
	36	HASL processing capacity	component hole diameter		hole diameter>0.5mm	0.4mm≤hole diameter≤0.5mm
			board thickness		0.5mm≤board thickness≤3.5mm	0.4mm≤board thickness<0.5mm
			thickness		2um≤thickness of Tin≤30um	\	\
	37	Acceptance Criteria	IPC standard		IPC2 level standard	IPC Level 3 standard

PCB Manufacturing Capabilities

Standard PCB Capabilities

Advanced PCB Capabilities